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TYPE C 公头 24P 带EMI双贴款 CONN Molding结构
NOTES:
1.Material:See Table
2.Finished:See Table
3.Mechenical:
Insertion force: 0.5~2.0kgf
Removal force: 0.8~2.0kgf
Durability: 10000 times
4.Electrical:
Current rating: 5.0A Max
Voltage rating: 5.0V
Insulation resistance:100MΩ Min
Dielectric withstand voltage.AC 100V for 1Minute.
5.Environmental:
Oferating temperature:-30℃~+80℃
6.IR REFLOW:
The peak temperature on the board shall be maintained for 10 seconds at 260℃
1.Material:See Table
2.Finished:See Table
3.Mechenical:
Insertion force: 0.5~2.0kgf
Removal force: 0.8~2.0kgf
Durability: 10000 times
4.Electrical:
Current rating: 5.0A Max
Voltage rating: 5.0V
Insulation resistance:100MΩ Min
Dielectric withstand voltage.AC 100V for 1Minute.
5.Environmental:
Oferating temperature:-30℃~+80℃
6.IR REFLOW:
The peak temperature on the board shall be maintained for 10 seconds at 260℃
所属分类
- 产品规格
- 材质用料
- 3D图
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TYPE C 公头 24P 带EMI双贴款 CONN Molding结构
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MATERIAL:
1.SHELL：STAINLESS STEEL ,Ni PLATED 30u"~150u"
2.CONTACT：COPPER STEEL ,Ni 50u"Min;Au 3u"
3.MID PLATE：STAINLESS STEEL ,Ni 50u"Min
4.EMI：STAINLESS STEEL ,NO PLATING
5.MD HOUSING：HIGH TEMPERATURE RESISTANT PLASTIC UL94 V-0
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